吴翔，男，1990年4月出生，博士研究生。2020年6月毕业于中南大学材料科学与工程专业，获工学博士学位。2020年8月入职皇冠welcome体育材料科学与工程学院。

主要研究方向：

（1）高强高导耐热铜合金的组织性能表征及其相关机理研究

（2）高性能金属基复合材料的设计与应用

（3）快速凝固技术的研究与应用

参与的科研项目：

国家自然科学基金青年科学基金项目（5180041060），快速凝固高硅铝电子封装材料的稀土元素微合金化及强韧化机理研究，2019-2021，参研

近五年发表SCI期刊论文：

[1]X. Wu,R. Wang, C. Peng, Y. Feng, Z. Cai*, Effects of annealing on microstructure and mechanical properties of rapidly solidified Cu-3 wt% Ag-1 wt% Zr,Materials Science and Engineering: A, 2019, 739: 357-366.

[2] X. Wu, R. Wang, C. Peng, Y. Feng, Z. Cai*, Influence of hot isostatic pressing and forging on the microstructure and mechanical properties of Cu-3Ag-1Zr alloys, Materials & Design, 2019, 168: 107676.

[3] X. Wu, R. Wang, C. Peng, Y. Feng, Z. Cai*, Microstructures and elevated temperature properties of rapidly solidified Cu-3Ag-0.5Zr and Cu-3Ag-0.5Zr-0.4Cr-0.35Nb alloys, Journal of Alloys and Compounds. 2019, 803: 1037-1044.

[4] X. Wu, R. Wang, C. Peng, Y. Feng, Z. Cai*, Effects of cold rolling and low-temperature annealing on microstructure and mechanical properties of rapidly solidified Cu-3Ag-0.5Zr alloy,Materials Science and Engineering: A, 2020, 773: 138829.

[5]X. Wu, R. Wang, C. Peng, G. Jiang*, Microstructure stability and tensile properties of Cu-3Ag-1Zr alloy fabricated by rapid solidification and cold rolling, Materials Characterization. 2020, 160: 110091.

[6] X. Wu, R. Wang, C. Peng, J. Zeng*, Ultrafine grained Cu-3Ag-xZr (x = 0.5, 1.0 wt%) alloys with high strength and good ductility fabricated through rapid solidification and cryorolling,Materials Science and Engineering: A, 2020, 778: 139095.

[7] X. Wu, R. Wang, C. Peng, X. Wang*, Low-temperature annealing behavior and tensile properties of the rapidly solidified Cu3Ag0.5Zr0.4Cr0.35Nb alloy reinforced by cold rolling, Journal of Alloys and Compounds,2020, 828: 154371.

[8] S. Yu, R. Wang, C. Peng, Z. Cai*, X. Wu, Y. Feng, X. Wang, Effect of minor scandium addition on the microstructure and properties of Al-50Si alloys for electronic packaging, Journal of Materials Science: Materials in Electronics, 2019, 30: 20770-20777.

[9] Z. Cai, C. Zhang*, R. Wang, C. Peng, X. Wu, H. Li, High-temperature mechanical properties and thermal cycling stability of Al-50Si alloy for electronic packaging,Materials Science and Engineering: A, 2018, 728: 95-101.

[10] Z. Cai, C. Zhang*, R. Wang, C. Peng, X. Wu, H. Li, Microstructure, mechanical and thermo-physical properties of Al-50Si-xMg alloys, Materials Science and Engineering: A, 2018, 730: 57-65.

[11] Z. Cai, C. Zhang*, R. Wang, C. Peng, X. Wu, Effect of copper content on microstructure and mechanical properties of Al/Sip composites consolidated by liquid phase hot pressing, Materials & Design, 2016, 170: 10-17.

[12] Z. Cai, C. Zhang*,R. Wang, C. Peng, X. Wu, H. Li*, M. Yang. Improvement of deformation capacity ofgas-atomized hypereutectic Al-Si alloy powder by annealing treatment, Transactions of Nonferrous Metals Society of China,2018,28(08):1475-1483.

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